AMD Investor Day Presentation Deck

SCALING HORIZONTALLY AND VERTICALLY HBM Scalable Solution = Lithographically Defined Substrate GPU 2.5D Elevated Fanout Bridge Standard Flip Chip Process EFB Lower Complexity Bumping, Assembly Process Standard Substrates Lower Cost 3D Cache Die CPU Die > 3X Interconnect Energy Efficiency Compared to Micro Bump 3D See endnotes EPYC-26 and EPYC-27. -- 3D Cache Metal Stack 3D Hybrid Bonding ‒‒‒‒ CPU Die Metal Stack >15X Interconnect Density Compared to Micro Bump 3D

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