GlobalFoundries Investor Day Presentation Deck slide image

GlobalFoundries Investor Day Presentation Deck

Investing for a Bold Future ♫ FinFET Feature-Rich CMOS 130nm BCDLite®Gen1 BCDLite® Gen2 BCD Auto BCD+NVM BCD 120V 55nm BCDLite® eNVM BCD IVR SPAD/BSI Auto 40nm Auto ISP DDI/HV eNVM mmW 28nm ISP DDI/HV eNVM BCDLite® μLED 12LP Auto RF IC 12LP+ ULP HDLV RRAM ATV-150 FDX™M FD-SOI 22FDX ULL/ULP RF/ mmW MRAM Auto ISP RRAM IVR TSV HBT 22FDX+ ULL/ULP RF-Gen2 MRAM-G2 RRAM 12FDX RF/mmW ULL/ULP (((-1)) RF SOI 180nm 7SW LNA SW PA NSX NSX-Gen2 8SW LNA SW Low latency LNA EDMOS PA 9SW 90nm 45RFSOI 45nm Y DG SiPh 90nm 90WG 250μm pitch Fiber Array attach High Power Wave Guides 45CL0 127um pitch Fiber Attach TSV On-Die Laser Micro-ring Modulators Custom 45SP3 45SPQ Production Platform Features Development Platform Features SiGe 130nm Power Amp 8HP+ Power Amp TSV 9HP Power Amp 9HP+ 45SG01 Power Amp 40LP-SiGe [] GaN/Si (WBG) GaN/Si PA Power ☐ ☐ Huge Features Portfolio: 120 Technology Solutions enabling thousands of customer products 2022 Expansion: +16 Technology Solutions + 6 new platforms + dozens of new features in dev. Beyond Si Solutions: Adding Wide Bandgap materials for Power and RF - GaN/Si GlobalFoundries © 2022 All Rights Reserved 58
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