KLA Investor Conference Presentation Deck
Advanced Packaging: Crucial to Semiconductor Technology Roadmap
[Lead frame]
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Leadframe
IC Chip (Die)
16 KLA Non-Confidential | Unrestricted
Resin
Fin
3D PACKAGING: A CATALYST FOR PRODUCT INNOVATION
Tovern" is a new 30 technology invented at intel that allows logic chips to be stacked for the first time, helping deliver high
compuls density and eating a complete redking of system architecture. Here's a representation of how desca
bult in a whole new
TOP VIEW
SIDE VIEW
3-D INTEGRATION (SYSTEM-IN-PACKAGE)
All the benefits of 20 integration plus a new leve of dea
a cada anature of systems-
Source: Intel
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intel)
Vision chipset
DISCRETE ICS-KEY
Tayy
Top dies
ubump
RDL Interposer
C4
PCB Substrate
BGA
From IC Protection to Performance Differentiation
smo 3D Fabric
SOC
Source: tsmc
SOC
PCB Substrate
DRAM
Logic
HBM
TM
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