KLA Investor Day Presentation Deck
2019E
SAM
2019E
KLA¹
Targeting New SAM | Advanced Packaging
KLA: ICOS
Orbotech: PCB
$900M
$430M²
PCB, Substrate, Components
PCB
10μm
Component
ICS
KLA: SWIFT, ICOS
Orbotech: PCB, SPTS
$350M →~$1,350M (2023)
5μm
$100M³ →~$400M (2023E)
Advanced Packaging, Advanced Substrate
Wafer Level Packaging
Panel Level Packaging
+$1.0B
Incremental
Addressable
Market4
Advanced IC Substrates
KLA: All Semi PC Products
Orbotech: SPTS
1μm
$1,300M
$620M5
Trailing Semi
2μm
Advanced Packaging: Interconnect 1µm to 5µm, Panel and Wafer Opportunities
$5,400M
71 KLA Non-Confidential | Unrestricted ¹ Revenue, which includes Service; 2 PCB + ICOS CI; ³ SPTS AP + SWIFT BE + ICOS Zeta, F160; 4 8% CAGR + 3D WLP + Adv ICS + SPTS ECD; 5 SPTS + SEMI PC System + SEMI PC Service.
3
$3,650M
Wafer Fabrication
0.1μm
Advanced Semi
KLA+View entire presentation