KLA Investor Day Presentation Deck

Advanced Packaging: Crucial to Semiconductor Technology Roadmap (% 1 Improved bandwidth Boost in power performance KLAB KLA# New high-end applications 95199 KLA# KLAB Custom form factors FEE 20 160 160 60 From device protection to performance differentiation $ ‒‒‒‒‒‒ Increased overall Si area KLAH Investor Day 71

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