KLA Investor Day Presentation Deck
Case Study: PCB AOI¹ Fine for Advanced IC Substrates
IC substrates are key enablers
of advanced packaging
technology roadmap
■
Air gap for on-axial
aberration compensation
1999
HR
¹AOI = Automated Optical Inspection
LR
Problem
▪ Suppliers facing challenges to scale capability,
capacity and yield
Developed new inspection platform with advanced integrated optics jointly
with KLA central engineering and CTO group
**
■
Air gap for on-axial
aberration compensation
■
Smaller feature sizes driving more advanced
panel-based inspection capability
Current inspection products do not meet
market requirements
Solution
a
Tube
Results
Improved contrast and resolution
Current
Unique defects detected
$200-250M cumulative systems revenue in next 5 years
EPC - KLA joint development effort to enable aggressive IC substrate technology roadmap
KLAH Investor Day 80View entire presentation