KLA Investor Day Presentation Deck slide image

KLA Investor Day Presentation Deck

Case Study: ICOS Component (Final Package) Inspection ■ ■ Multi-die components have higher quality requirements ■ Problem Complexity and cost driving 100% inspection of final multi-die components Large form factor, complex architecture and shrinking geometry require advanced inspection and metrology Solution Developed new inspection platform for large form factor components at very fast throughput Designed new optics to optimize focus on every surface to improve defect detection Created new top 3D metrology capability to accurately measure height of each die KLA THE ICOS™M T390 component inspection ŞM CY16 Results Increased defect sensitivity and accurate 3D metrology Top 3D - Die height & capacitor height ICOS component inspection (2.5D/3D) revenue CY17 CY18 CY19 CY20 Complex packages require more advanced inspection and metrology capability CY21 CY22E KLAH Investor Day 75
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