KLA Investor Day Presentation Deck

High Performance Computing Drives Package Complexity 2009 Flip chip BGA intel. NVIDIA. tsmc AMD SAMSUNG Micron HPC (High Performance Compute) Package Evolution CPU / GPU / FPGA 2014 + Flip chip BGA New performance requirements bring increased package complexity and drive massive investment 2020 2.5/3D Heterogeneous integration Smaller feature sizes 2021+ 2.5/3D 2D and 3D integration schemes Packaging is experiencing lateral scaling and vertical stacking at the same time KLAH Investor Day 72

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