KLA Investor Day Presentation Deck

KLAH Orbotech | Developing Differentiated Technology DI (Direct Imaging) 3μm and 5μm, Advanced ICS and Panel AOI (Automated Optical Inspection) 3μm, Advanced ICS and Panel ■ Large Scale Optics ▪ Large Depth of Focus ▪ Advanced Algorithms 73 KLA Non-Confidential | Unrestricted ▪ Multi-Wave Illumination ▪ On-the-Fly 2D Metrology ▪ New 3D Module 3D Inspection Wafer Level Packaging ■ Bump I/O Leverage Technology to Better Address Market Needs IC Substrate Ball I/O PCB Chip Pitch RDLs II ▪ Market Validation ■ Product Requirement Specs Feasibility Study Pitch KLA+

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