KLA Investor Day Presentation Deck
Case Study | Advanced Packaging Business Development
BACKGROUND
Mid 2010s: Lateral Scaling
slowed down or become too
expensive
Advanced packaging enabled
performance at lower cost
New technologies were
developed in mobile and
computing chip packaging
Inflection opened new
market opportunity for SPTS
Market leader in key etch and
film applications
SOLUTION
70 KLA Non-Confidential | Unrestricted
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Targeted key underserved applications
Customize existing technology to serve
advanced packaging market
Collaborate with industry leaders to
validate differentiated performance
Technology choice for Fan Out wafer
level package at #1 foundry
Memory PCB substrate.
Memory Die
SYSTEMP SPTS PVD
CONSULTI
2014
SPTS Etch
Customer Collaboration, Technology Flexibility and Execution
REVENUE TREND
Strong Track Record of Business Development
Technology driven
business: ~3x
Trough inFO
via (TIV)
RDL
2019E
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