KLA Investor Day Presentation Deck slide image

KLA Investor Day Presentation Deck

Complementing Industry Screening Methods to Improve Reliability ▪ Current screening methodology is a statistical technique that was introduced by Automotive Electronics Council (AEC) in 1997 and based on an Electrical Test (EWS¹) New Automotive Process Control Methodology "Zero-Defect" Pyramid I 2016: 5M vehicle recall after defects found within corroding airbag semiconductors, resulting in a cost of $10B to manufacturers ▪ 2019: KLA defines new screening methodology to minimize failures in automotive semiconductor technology Pass Reliability Risk Fail 87 KLA Non-Confidential | Unrestricted 1 EWS Electrical Wafer Sorting. Die Screening Prevent potential reliability failures from escaping the fab AI I-PAT Screening Analytics (what matters) Recipe Quality (sensitivity) Strategy and Methods (sampling, layers, BKMs) Capability and Capacity (tools, tool health) Process Control Optimize fab quality reducing overall defectivity KLA+
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