KLA Investor Day Presentation Deck
Case Study | KLA EBEAM + Optical Opportunity
CHALLENGE
Traditional EBEAM tools
cannot run at high speed
while maintaining high
resolution
Missing critical defects in
small inspected area
■
KLA UNIQUE SOLUTION
KLA EBEAM unique connectivity with KLA Optical
tools enables fast detection for ultra small defects
KLA Al-Assisted EBEAM
KLAB
Unique Connectivity
▪ Highest resolution at highest
throughput
■ Full Al based detection and
classification
■ All defects captured
37 KLA Non-Confidential | Unrestricted 1 High Volume Manufacturing (HVM).
I
I
KLA Optical Inspectors
Full wafer coverage at HVM¹ speed
Fastest time to wafer signature in
EUV era
OPPORTUNITY
Reduce time cycle of
learning for customer
Accelerates yield ramp
Early customer
engagements have been
promising; full product
release expected in 2020
KLA Provides a Seamless Single Inspection Solution for All Defect Types
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