KLA Investor Day Presentation Deck

Minimum Pitch EUV and Reticle Inspection Landscape >4xnm 4xnm 3xnm 2xnm + 193nm Optical Extension Pitch Relaxation T TeraScanTM 5xx Teron™ 6xx + + 10% EUV 90% +Teron™ 6xx XP + + 7xx (actinic EUV system) EUV Double Patterning + 8xx (e-beam system) Best CoO Solution + |+|+| High NA EUV Gap Layers ■ Semi PC mission: release the best cost of ownership solution by leveraging the portfolio ▪ Optical reticle inspection is the workhorse of today's EUV in HVM ■ Multiple 8xx e-beam systems shipped to address gap layers ▪ Actinic EUV tool in development, intersecting with High NA EUV Semi PC reticle inspection strategy utilizes multiple technologies to deliver best CoO solution for customers KLAH Investor Day 52

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