KLA Investor Day Presentation Deck

Defining Standards to Address Industry Challenges Failure Sources >50% of Failure Sources Are Due to Electronic Defects 35% 4% 14% 29% 18% ■ Systematic Failures ■ Random Failures ■ Test Coverage Failures Wire Bonding Other 1 KLA Opportunities to Address ▪ Advancing design rules New "exotic" materials (e.g., Si Carbide) Extreme operating environment Rigorous in-line screening methodology Optimized electrical test coverage I ■ ■ Critical to Meet 'Zero-Defect' Quality and Reliability Industry Standards 86 KLA Non-Confidential | Unrestricted Source: Auto OEMs; ¹ Other includes: NTF (no trouble found), EIPD (electrically induced physical damage) and delamination. KLA+

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