KLA Investor Day Presentation Deck
High Exposure to Mega Trends and Fast-Growing Industries
■
MEGA TRENDS ACROSS...
ARTIFICIAL 10 10
10 1 0
INTELLIGENCE
0 10 10
■ Al based defect
classification in PCB and
FPD inspection tools
Significant inflections in
packaging via multi-chip
integration
66 KLA Non-Confidential | Unrestricted
H
5G
5G
CONNECTIVITY
High RF content in base
stations and handsets
Packaging innovations
driving customized process
solutions
1 SAP = Semi Additive Process.
MOBILE
▪ Accelerated transition to 2nd
wave of mSAP¹ in PCB
▪ Foldable phones (and
wearable) driving transition
to flex PCB and displays
High content of MEMS,
sensors, RF devices
...KEY INDUSTRIES
DATA CENTER
▪ Transition from
conventional PCB to
advanced IC Substrate
Strategic collaborations to
influence semiconductor
and PCB supply chain
AUTOMOTIVE
■ Transition from
conventional to High
Density PCB
▪ More displays in cars (dash,
head-on and infotainment)
▪ Transition to new material
(SIC, GaN) in EV
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