KLA Investor Day Presentation Deck slide image

KLA Investor Day Presentation Deck

Transition to GAA Architecture Brings Additional Process Complexity E KLA Gen4 Gen5 FinFET High End Films 50% increase in number of critical inspection layers 30% increase in high end film metrology layers Gen4 Note: KLA internal estimates based on representative inspection and metrology run cards for advanced logic nodes Gen5 GAA High End Films number of inspection steps number of metrology steps KLAB R&D inflections continue to drive Semi PC growth Process Control Portfolio Refresh Driven by Industry Technology Inflections Gen4 refresh leveraging Gen5 technology ▪ Metrology refresh leveraging advanced algorithms and Al ■ KLAH Investor Day 37
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