KLA Investor Day Presentation Deck

Case Study: SPTS Plasma Dicing for Advanced Packaging Wafers are cut into single die in a singulation process before final assembly ■ ■ ■ Problem Wafer singulation is usually done with blade and/or laser, which creates particles and cracks Defects can lead to failures of entire multi-die package, causing huge economic losses Plasma etch based singulation provides superior cleanliness, but integration is complex Solution Developed differentiated plasma dicing solution State-of-the-art demo lab created to develop full integration process around wafer singulation Validated process performance via multiple advanced customer collaborations SPTS Mass SPTS Mosaic plasma dicing TM $M CY16 Results Plasma dicing results in smooth profile and low defectivity Rough Die Edge with Blade Dicing CY17 SPTS plasma dicing bookings CY18 PM FLACHADIGING D Clean Die Edge with Plasma Dicing CY19 Heterogenous integration requires new standard of cleanliness in wafer dicing CY20 CY21 CY22E KLAH Investor Day 76

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