#160 years TEL FY2023 (April 2022 - March 2023) Financial Announcement Agenda: ■ FY2023 Consolidated Financial Summary Hiroshi Kawamoto, Vice President & General Manager, Finance Unit ■ Business Environment and Financial Estimates Toshiki Kawai, Representative Director, President & CEO ててせて。 www E#2Forward Looking Statements Disclaimer regarding forward-looking statements Forward-looking statements with respect to TEL's business plan, prospects and other such information are based on information available at the time of publication. Actual performance and results may differ significantly from the business plan described here due to changes in various external and internal factors, including the economic situation, geopolitical risk, semiconductor/FPD* market conditions, intensification of sales competition, safety and product quality management, intellectual property-related risks and impacts from COVID-19. Processing of numbers For the amount listed, because fractions are rounded down, there may be the cases where the total for certain account titles does not correspond to the sum of the respective figures for account titles. Percentages are calculated using full amounts, before rounding. Foreign exchange risk In principle, export sales of Tokyo Electron's mainstay semiconductor and FPD production equipment are denominated in yen. Although some sales and expenses are denominated in foreign currencies, the impact of exchange rate fluctuations on profits is negligible, unless extreme fluctuations occur. * FPD: Flat panel display CORP IR / May 11, 2023 TEL 2#3TEL FY2023 Consolidated Financial Summary May 11, 2023 Hiroshi Kawamoto Vice President & General Manager, Finance Unit ててせて。 www E 600 years#4FY2023 (April 2022 - March 2023) Financial Highlights Net Sales and Gross Profit Margin Net sales (\B) Gross profit margin Operating Income and Operating Margin 2,209.0 Operating income (\B) Operating margin 617.7 599.2 2,003.8 Net Income Attributable to Owners of Parent and ROE 471.5 Net income attributable to owners of parent (\B) ROE 437.0 1,399.1 44.6% 1,278.2 1,127.2 45.5% 310.5 320.6 248.2 242.9 32.3% 28.0% 37.2% 41.2% 40.1% 40.4% 237.2 185.2 29.9% 30.1% 26.5% 24.3% 22.9% 21.0% 21.8% FY'19 FY'20 FY'21 FY'22 FY'23 FY'19 FY'20 FY'21 FY'22 FY'23 FY'19 FY'20 FY'21 FY'22 FY'23 From the beginning of FY2022, the Company applies "Accounting Standard for Revenue Recognition" (ASBJ Statement No. 29). Percentages of changes are based on consolidated financial results without the effects of the new standards of the same period of the previous fiscal year. Steadily met the expansion of SPE* demand. Sales increased by 10% YoY Gross profit and operating income reached record high CORP IR / May 11, 2023 * SPE: Semiconductor production equipment TEL 4#5Financial Summary FY2022 FY2023 YOY Change (Billion Yen) (Reference) FY2023 estimates announced on Feb. 9, 2023 Net sales SPE FPD Gross profit Gross profit margin SG&A expenses 2,003.8 2,209.0 +10.2% 2,170.0 1,943.8 2,155.2 +10.9% 2,118.0 59.8 53.6 -10.3% 52.0 911.8 984.4 +8.0% 946.0 45.5% 44.6% -0.9pts 43.6% 312.5 366.6 +17.3% 366.0 Operating income 599.2 617.7 +3.1% 580.0 Operating margin 29.9% 28.0% -1.9pts 26.7% Income before income 596.6 624.8 +4.7% 584.0 taxes Net income attributable to 437.0 471.5 +7.9% 433.0 owners of parent EPS (Yen) 935.95 1,007.82 +7.7% 925.38 R&D expenses 158.2 191.1 +20.8% Capital expenditures 57.2 Depreciation and amortization 36.7 74.4 42.9 +29.9% +16.9% 1. In principle, export sales of Tokyo Electron's mainstay semiconductor and FPD production equipment are denominated in yen. Although some sales and expenses are denominated in foreign currencies, the impact of exchange rate fluctuations on profits is negligible. 2. Profit ratios are calculated using full amounts, before rounding. 3. EPS is calculated based on the number of outstanding shares excluding treasury stock after the stock split. CORP IR / May 11, 2023 TEL 5#6Financial Summary (Quarterly) (Billion Yen) FY2022 FY2023 Q4 Q1 Q2 Q3 Q4 vs. FY2023Q3 Net sales SPE 564.8 473.6 709.2 467.8 558.2 +19.3% 549.2 464.0 689.0 458.8 543.3 +18.4% FPD Gross profit Gross profit margin 15.5 9.6 20.1 8.9 14.9 +66.5% 255.9 200.5 328.2 203.9 251.6 +23.4% 45.3% 42.3% 46.3% 43.6% 45.1% +1.5pts SG&A expenses 87.3 83.0 95.6 89.1 98.9 +11.0% Operating income 168.5 117.5 232.6 114.7 152.7 +33.1% Operating margin 29.8% 24.8% 32.8% 24.5% 27.4% +2.9pts Income before income taxes 168.1 117.6 235.2 116.3 155.6 +33.8% Net income attributable to 126.8 88.0 179.2 85.5 118.6 +38.7% owners of parent R&D expenses 44.1 42.1 49.1 46.1 53.7 +16.6% Capital expenditures 14.7 18.0 17.3 12.5 26.3 +109.8% Depreciation and amortization 10.2 9.7 9.8 11.2 12.0 +7.0% 1. In principle, export sales of Tokyo Electron's mainstay semiconductor and FPD production equipment are denominated in yen. Although some sales and expenses are denominated in foreign currencies, the impact of exchange rate fluctuations on profits is negligible, unless extreme fluctuations occur. 2. Profit ratios are calculated using full amounts, before rounding. CORP IR / May 11, 2023 TEL CO 6#7Segment Information SPE (Semiconductor Production Equipment) FPD (Flat Panel Display Production Equipment) (Billion Yen) 2,500 (Billion Yen) 60% 200 Sales Sales Segment income 2,155.2 Segment income Segment profit margin Segment profit margin 50% 2,000 1,943.8 150 40% 34.3% 1,500 32.3% 30% 100 1,000 20% 59.8 667.4 696.3 50 50 500 60% 100% 50% 40% Composition of Net Sales. 2 FPD 30% 97 98 SPE 20% 53.6 10% 6.5% 10% 2.0% 3.8 1.0 0% 0 0% 0% FY'22 FY'23 FY'22 0 FY'22 FY'23 1. Segment income is based on income before income taxes. 2. FY'23 R&D expenses such as fundamental research and element research, etc. and other general and administrative expenses are not included in the above reportable segments. 3. Composition of net sales figures is based on the sales to customers. CORP IR / May 11, 2023 TEL 7#8SPE Division: New Equipment Sales by Product (Billion Yen) 2,000 Coater/Developer Etch system ■Deposition system ■Cleaning system 1,500 Wafer prober Others 1,692.7 1,499.0 26% 23% FY2023 new equipment sales increased by 12.9% YoY to ¥1,692.7B 963.1 1,000 34% 25% 39% 38% 500 21% 21% 21% 11% 12% 8% 7% 5% 5% FY'21 FY'22 CORP IR / May 11, 2023 Although there was a change in the composition ratio of equipment due to changes in the customers' investment mix, overall new equipment sales increased YoY FY'23 Percentages on the graph show the composition ratio of new equipment sales. Field Solutions sales are not included. TEL 8#9SPE Division: New Equipment Sales by Application (Billion Yen) 2,000 DRAM ■Non-volatile memory 1,692.7 Logic foundry 1,499.0 14% 1,500 Logic & others Logic foundry + 26% 20% Logic & others ■ In logic/foundry, sales increased significantly on the back of solid investment 1,000 963.1 21% 24% ■ Due to inventory adjustments by customers, sales composition for memory decreased 26% 66% 500 53% 24% 26% 0 FY'21 CORP IR / May 11, 2023 FY'22 FY'23 Percentages on the graph show the composition ratio of new equipment sales. Field Solutions sales are not included. TEL 6#10Field Solutions Sales (Billion Yen) 500 I Used equipment and modification Parts and services 474.0 455.9 120.0 400 362.3 156.3 300 113.8 200 354.0 299.6 248.5 100 0 FY'21 CORP IR / May 11, 2023 FY'22 FY'23 FY2023 Field Solutions sales increased by 4.0% YoY to ¥474.0B ■ Parts and services sales continued to be solid TEL 10 10#11Balance Sheet (Quarterly) Assets (Billion Yen) Liabilities & Net Assets (Billion Yen) 2,311.5 2,311.5 2,138.0 2,138.0 2,092.7 2,092.7 Cash & cash 473.1 1,894.4 1,846.9 equivalents* 1,894.4 1,846.9 712.0 484.6 387.4 Liabilities 645.8 658.3 371.2 314.6 464.8 454.4 Notes and accounts receivable trade, and contract assets 547.4 532.0 507.7 433.9 426.1 652.2 Inventories 632.0 473.8 552.9 557.2 1,492.1 1,599.5 Net assets 150.7 1,347.0 1,434.3 Other current assets 1,314.8 129.6 62.0 94.4 120.5 259.0 Tangible assets 223.0 238.3 246.1 246.1 22.5 24.6 26.3 240.1 223.9 225.6 27.4 224.5 28.5 282.9 Intangible assets Investment & other assets Q4 Q1 Q2 Q3 Q4 FY'22 FY'23 Q4 FY'22 Q1 FY'23 Q2 Q3 Q4 * Cash and cash equivalents: Cash and deposits + Short-term investments, etc. (Securities in B/S). CORP IR / May 11, 2023 TEL 11#12Cash Flow (Quarterly) (Billion Yen) 250 New revenue recognition 200 150 100 109.6 86.5 50 0 -50 -0.5 -23.1 -100 -150 -200 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 FY'21 FY'22 FY'23 Cash flow from operating activities 58.6 111.2 94.6 114.6 -37.1 69.9 193.4 53.2 109.6 Cash flow from investing activities*1 Cash flow from financing activities -19.1 -15.7 -15.5 -13.5 -20.7 -16.6 -23.1 -13.8 -23.1 -0.1 -65.9 -0.2 -100.7 -0.2 -119.1 -2.1 -134.6 -0.5 Free cash flow*2 39.4 95.5 79.0 101.0 -57.9 53.3 170.2 39.3 86.5 Cash on hand*3 311.5 341.7 420.4 423.9 371.2 314.6 484.6 387.4 473.1 *1 Cash flow from investing activities excludes changes in time deposits and short-term investments. *2 Free cash flow = cash flow from operating activities + cash flow from investing activities (excluding changes in time deposits and short-term investments). *3 Cash on hand includes cash and cash equivalents + time deposits and short-term investments with original maturities of more than three months. CORP IR / May 11, 2023 TEL 12#13TEL Business Environment and Financial Estimates May 11, 2023 Toshiki Kawai Representative Director, President & CEO ててせて。 www E 600 years#14FY2023 Highlights Achieved record highs in net sales and profit - Nets sales of ¥2.209T, operating income of ¥617.7B, net income of ¥471.5B Largest R&D investment of ¥191.1B Steady progress in acquiring new POR*¹s in strategic products and selection of development PORs for future growth ▪ Established DSS*2 BU starting from FY2024, to strengthen activities targeting MAGIC market MAGI C Metaverse Autonomous mobility Green energy loT & information Communications CORP IR / May 11, 2023 *1 POR (Process of record): Certification of the adoption of equipment in customers' semiconductor production processes *2 DSS (Diverse Systems and Solutions) TEL 14#15Highlights of FY2023: Establishment of New Vision and the Medium-term Management Plan A company filled with dreams and vitality that contributes to technological innovation in semiconductors Tokyo Electron pursues technological innovation in semiconductors that supports the sustainable development of the world. We aim for medium- to long-term profit expansion and continuous corporate value enhancement by utilizing our expertise to continuously create high value-added leading-edge equipment and technical services. Our corporate growth is enabled by people, and our employees both create and fulfill company values. We work to realize this vision through engagement with our stakeholders. Financial Targets (by FY'27) Net sales ≥ 3 trillion yen TSV OP margin ≥ 35% TEL's Shared Value ROE ≥ 30% CORP IR / May 11, 2023 Net Zero Scope 1 & 2 To be achieved by 2040 Scope 3 To be achieved by 2050 TEL. 15#16Business Environment (Outlook as of May 2023) Semiconductor market in CY2023 will decrease by approx. 10% YoY, while CY2024 is expected to exceed CY2022. Although WFE*1 market is now in an adjustment phase, it is expected to gradually recover, beginning with logic/foundry, in CY2023 H2 and to be approx. $70-75B for the full year From CY2024, semiconductor and WFE markets are expected to recover towards further growth - - - • • Recovery in demand for consumer electronic devices and in corporate IT investment accompanying macroeconomic recovery Expansion of data center investment accompanying the transition towards a data-driven society Accelerated server replacement with new CPUs (higher performance, lower power consumption) Expansion of new applications including utilization of generative Al and the metaverse Recovery in smartphone demand due to macroeconomic recovery Increased demand for replacement of PCs purchased during COVID-19 accompanying OS migration Continued increase in the number of semiconductors in automobiles due to the spread of EVs/autonomous-driving - Increased investment in new technology nodes; DRAM: 1b nm/1c nm, NAND: 200+ levels (Partial introduction of CBA*2), Logic: 3 nm/2 nm nodes (Nanosheet) *1 WFE (Wafer fab equipment): The semiconductor production process is divided into front-end production, in which circuits are formed on wafers and inspected, and back-end production, in which wafers are cut into chips, assembled and inspected again. Wafer fab equipment refers to the production equipment used in front-end production and in wafer-level packaging production. *2 CBA CMOS bonded array CORP IR / May 11, 2023 TEL. 16#17Business Opportunities and Focus Areas by FY2025 Logic DRAM NAND Image of device Requirements Low-power/high-speed CPU High-speed Working Mem. (DDR5) Technological changes ■ GAA Nanosheet Backside PDN*1 Business opportunities Selective etch Deposition with new materials Supercritical drying Bonding/ laser edge trimming ■ EUV HKMG*2 CMOS peripheral circuits ■ Coater/Developer for EUV Deposition with new materials Supercritical drying High-capacity storage ■ Multi-layer / tier stacking Peripheral bonding ■ Introduction of new materials for memory cells ■ HARC etch Wet etch, new drying technology ■ New low-resistance metal ■ Bonding ■ Wafer warpage suppression technology CORP IR / May 11, 2023 Growth opportunities are ever-expanding *1 Backside PDN (Power delivery network): Design to provide power supply and reference voltage effectively to active devices *2 HKMG (High-k metal gate): Transistors which have metal gates with high dielectric constant materials TEL 17#18FY2024 Financial Estimates CORP IR / May 11, 2023 TEL. 18#19FY2024 Financial Estimates FY2024 (Estimate) (Billion yen) FY2023 (Actual) H1 H2 Full Year Full Year YoY Change Net sales 2,209.0 790.0 910.0 1,700.0 -23.0% Gross profit 984.4 333.0 408.0 741.0 -24.7% Gross profit margin 44.6% 42.2% 44.8% 43.6% -1.0pts SG&A expenses 366.6 172.0 176.0 348.0 -5.1% R&D 191.1 95.0 105.0 200.0 +4.7% Other than R&D 175.4 77.0 71.0 148.0 -15.7% Operating income 617.7 161.0 232.0 393.0 -36.4% Operating margin 28.0% 20.4% 25.5% 23.1% -4.9pts Income before income 624.8 162.0 233.0 395.0 -36.8% taxes Net income attributable 471.5 120.0 180.0 300.0 -36.4% to owners of parent 1,007.82 256.21 Net income per share (Yen) The Company implemented a 3-for-1 common stock split on April 1, 2023. Net incomes per share are calculated on the assumption that stock split was implemented at the beginning of FY2023. 640.53 -367.29 Forecasting a record high ¥200B in R&D expenses despite a 5% YoY decrease in SG&A expenses overall TEL. 19 CORP IR / May 11, 2023#20FY2024 SPE New Equipment Sales Forecast Sales by Application (Billion yen) 1,000 917.7 ■DRAM 15% 775.0 690.0 13% 23% 573.0 16% 22% 500 24% 9% ■Non-volatile memory 10% 62% 71% 69% 66% ■Logic foundry + Logic & others 0 FY'23 H1 (Actual) FY'23 H2 (Actual) FY'24 H1 (Estimates) (Estimates) FY'24 H2 Sales expected to bottom out in H1, then move towards a recovery TEL. 20 CORP IR / May 11, 2023 Percentages on the graph show the composition ratio of new equipment sales. Field solutions sales are not included.#21FY2024 R&D Expenses and Capex Plan New development building (Deposition system, etch system, corporate R&D) Tohoku Production and Logistics Center (Deposition system) (Billion Yen) R&D expenses 200 191.1 200.0 કફ ને વળ 120.2 136.6 158.2 de & cas 100 Nirasaki-city, Yamanashi Prefecture (Completion scheduled for summer 2023) New development building (Coater/Developer, Surface preparation systems) Oshu-city, Iwate Prefecture (Completion scheduled for autumn 2025) New development building (Etch systems) 0 FY'20 FY'21 FY'22 FY'23 FY'24 (E) (Billion Yen) 150 ■Capex ■Depreciation 124.0 100 74.4 54.6 53.8 57.2 57.0 42.9 50 33.8 36.7 29.1 Koshi-city, Kumamoto Prefecture (Completion scheduled for summer 2025) Kurokawa-gun, Miyagi Prefecture (Completion scheduled for spring 2025) 0 FY'20 FY'21 FY'22 FY'23 FY'24 (E) Continue aggressive R&D and capital investment for sustainable growth CORP IR / May 11, 2023 TEL. 21#22Yen 500 FY2024 Dividend Forecast Dividend per Share (Figures in parentheses represent amounts without taking into account stock splits.) 252 (758) 196 (588) 260 (781) 0 FY'19 FY'20 FY'21 570 (1,711) 467 Commemorative (1,403) FY'22 FY'23 320 (960) Year-end 192 TEL shareholder return policy Dividend payout ratio: 50% Annual DPS of not less than 50 yen* We will review our dividend policy if the company does not generate net income for two consecutive fiscal years We will flexibly consider share buybacks Interim 128 FY'24 (E) *Due to the stock split on April 1, 2023, the amount has been changed from 150 yen to 50 yen. Dividends per share from FY'19 to FY'23 are calculated on the assumption that the stock split was conducted at the beginning of FY'19. FY'23 includes the 60th anniversary commemorative dividends. Amounts before the stock split are shown in parentheses. Implemented a 3-for-1 common stock split on April 1 this year. Full-year dividends are expected to be ¥320 per share. CORP IR / May 11, 2023 TEL. 22#23Acquisition of Treasury Stock Plan to implement share repurchase of up to 120B yen Type of shares to be acquired Total number of shares to be acquired ■ Total cost of acquisition. Period of acquisition : Shares of common stock Up to 10 million shares (Equivalent to 2.1% of outstanding shares : Up to 120 billion yen excluding treasury stock) : From June 1, 2023 to December 31, 2023 We will continue to manage our balance sheet flexibly while considering our ability to generate cash, necessary cash on hand and growth investment capital CORP IR / May 11, 2023 TEL. 23#24Total Return Amount (Billion yen) 300 250 200 149.9 150 Commemorative 120.0 Amount of purchasing treasury stock 219.3 267.9* 100 150.3 ■Paid dividends 124.4 121.9 50 92.2 0 FY'19 FY'20 FY'21 FY'22 FY'23 FY'24 (E) CORP IR / May 11, 2023 *FY'23 dividend payment of 267.9 billion yen includes commemorative dividends (31.3 billion yen) TEL. 24 24#25Appendix CORP IR / May 11, 2023 TEL. 25#26Financial Performance (Quarterly) (Billion Yen) 800 700 600 500 400 300 200 100 60% 50% 558.2 O 45.1% 40% 30% O 27.4% 20% 152.7 118.6 10% 0 Q4 Q1 Q2 Q3 0% Q4 FY'22 FY'23 Net sales 564.8 473.6 709.2 467.8 558.2 Operating income 168.5 117.5 232.6 114.7 152.7 Net income attributable 126.8 88.0 179.2 85.5 118.6 to owners of parent Gross profit margin 45.3% 42.3% 46.3% 43.6% 45.1% Operating margin 29.8% 24.8% 32.8% 24.5% 27.4% CORP IR / May 11, 2023 TEL. 26 26#27Segment Information (Quarterly) SPE (Semiconductor production equipment) (Billion Yen) FPD (Flat panel display production equipment) Sales 700 Segment income 689.0 Segment profit margin 600 549.2 (Billion Yen) 60% 60 Sales Segment income Segment profit margin 50% 45 543.3 40% 30 500 464.0 458.8 36.7% 400 34.8% 30% 32.1% 28.8% 29.5% 300 252.5 190.9 200 133.5 100 Composition of Net Sales 60% 100% FPD 3 2 3 2 2 45% 30% 20.1 50% 97 98 97 46 15.5 14.9 15 15% 9.6 10.0% 8.9 20% 6.4% 174.6 0.9 2.0 135.5 0.0 0% 10% -0.6 0.3 0.0% -3.7% -6.4% 98 98 SPE 0 0% -15 -15% 0% Q4 Q1 Q2 Q3 Q4 Q4 Q1 Q2 Q3 Q4 Q4 Q1 Q2 Q3 FY'22 FY'23 FY'22 FY'23 FY'22 FY'23 1. Segment income is based on income before income taxes. Q4 40 2. R&D expenses such as fundamental research and element research, etc. and other general and administrative expenses are not included in the above reportable segments. 3. Composition of net sales figures is based on the sales to customers. CORP IR / May 11, 2023 TEL. 27#28SPE Division: New Equipment Sales by Application (Quarterly) (Billion Yen) 600 500 New revenue recognition 560.9 15% 428.1 431.2 DRAM 400 375.4 24% 11% 345.0 350.4 356.7 25% Non-volatile memory 343.7 315.0 15% 19% 31% 16% 15% Logic foundry 300 29% 23% 17% 20% 16% Logic & others (MPU, AP, others) 34% 18% 19% 200 31% Logic foundry + 61% 74% Logic & others 58% 64% 69% 100 28% 53% 50% 47% 18% Q4 FY'21 Q1 FY'22 Q2 Q3 Q4 Q1 FY'23 Q2 33 Q3 Q4 Percentages on the graph show the composition ratio of new equipment sales. Field Solutions sales are not included. CORP IR / May 11, 2023 TEL. 28#29Field Solutions Sales (Quarterly) (Billion Yen) 150 New revenue recognition 120 103.2 95.2 00 90 60 60 SPE Sales 30 50 FPD Sales 120.5 124.0 116.1 109.5 131.7 117.5 115.2 0 Q4 FY'21 Q1 FY'22 Q2 Q3 Q4 Q1 FY'23 Q2 Q3 Q4 100.4 2.8 92.9 117.3 113.3 121.1 2.3 3.1 2.7 2.8 107.2 2.3 128.0 115.0 3.6 2.5 112.0 3.2 CORP IR / May 11, 2023 TEL. 29 29#30SPE Division: Sales by Region Japan (Billion Yen) 600 400 North America (Billion Yen) 600 (Billion Yen) 600 400 344.3 400 268.0 228.9 238.3 200 200 Europe Korea (Billion Yen) 600 377.7 400 349.5 184.2 200 200 107.9 0 0 0 0 FY'22 FY'23 FY'22 FY'23 FY'22 FY'23 FY'22 FY'23 (Billion Yen) 600 Taiwan China S.E. Asia, Others Regional Composition (Billion Yen) (Billion Yen) S.E. Asia, 600 600 100% 5 513.5 496.7 26 23 Others China 420.2 400 359.2 400 400 18 19 Taiwan 50% 16 19 Korea 200 200 200 121.6 88.3 9 6 Europe 14 16 North America 12 11 Japan 0 0 0 0% FY'22 FY'23 FY'22 FY'23 FY'22 FY'23 FY'22 FY'23 CORP IR / May 11, 2023 TEL. 30#31SPE Division: Sales by Region (Quarterly) New revenue recognition (Billion Yen) 800 700 600 549.2 488.8 467.8 464.0 500 437.9 415.4 400 300 200 689.0 458.8 543.3 100 0 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 FY'21 FY'22 FY'23 Japan 53.6 54.8 53.9 63.1 56.9 42.0 90.5 48.2 57.6 North America 31.2 43.9 61.8 76.8 85.3 67.3 108.3 58.4 110.2 Europe 18.6 13.4 20.3 17.0 57.1 56.5 50.9 42.6 34.1 South Korea 101.4 95.3 93.5 93.0 95.9 85.1 84.2 75.4 104.7 Taiwan 88.2 62.8 102.5 87.4 106.3 96.8 133.8 110.1 79.4 China 102.2 153.6 108.8 132.2 118.8 94.0 168.6 102.7 131.2 S. E. Asia, Others 20.0 13.8 26.7 18.9 28.7 22.0 52.5 21.1 25.8 CORP IR / May 11, 2023 TEL. 31#32World Market Share of TEL's Main SPE* Products (CY2022) 89% 25% 34% 37% 29% Coater/Developer Dry Etch System Deposition System Cleaning System Wafer Prober 19% 43% 49% ALD CVD Oxidation/Diffusion Source SPE (excluding Wafer Prober): GartnerⓇ, "Market Share: Semiconductor Wafer Fab Equipment, Worldwide, 2022", Bob Johnson, Gaurav Gupta, Menglin Cao, 17 April 2023 Graph/chart created by TEL based on Gartner research. Gartner research. Calculations performed by TEL. Coater/Developer: Photoresist Processing (Track), Dry Etch System: Dry Etch, Deposition System: Tube CVD + Atomic Layer Deposition Tools + Oxidation/Diffusion Furnaces + Nontube LPCVD, ALD: Atomic Layer Deposition Tools, CVD: Tube CVD + Nontube LPCVD, Oxidation/Diffusion: Oxidation/diffusion Furnaces, Cleaning System: Single Wafer Processors + Wet Stations + Batch Spray Processors + Scrubbers + Other Clean Equipment GARTNER is a registered trademark and service mark of Gartner, Inc. and/or its affiliates in the U.S. and internationally and is used herein with permission. All rights reserved. Gartner does not endorse any vendor, product or service depicted in its research publications, and does not advise technology users to select only those vendors with the highest ratings or other designation. Gartner research publications consist of the opinions of Gartner's research organization and should not be construed as statements of fact. Gartner disclaims all warranties, expressed or implied, with respect to this research, including any warranties of merchantability or fitness for a particular purpose. CORP IR / May 11, 2023 Source SPE (Wafer Prober): TechInsights Manufacturing Analysis Inc., April 2023 Charts/graphics created by Tokyo Electron based on : TechInsights Manufacturing Analysis Inc. * SPE: Semiconductor production equipment TEL. 32#33TEL TOKYO ELECTRON TM