#1Wh 1010101101100010110010101010 2000101 1010101101000101 10010101001ort 100101010010 101010110110001011001010100101 101011011000101 10101011010001011 100010101001011010 ΑΙ 皿: ASMPT enabling the digital world Q2 2023 Results Presentation 26 July 2023 101010110110001011001 1010101101100010110010101001011010110101010101 1011000101010110101 1010101010110 1011000101100101010010110101101010101 10101100010110010101#2Disclaimer ASMPT digital world The information contained in this presentation is provided for informational purpose only and should not be relied upon for the purpose of making any investment or for any other purpose. Some of the information used in preparing this presentation was obtained from third parties or public sources. The information contained in this presentation has not been independently verified. No representation or warranty, expressed or implied, is made as to, and no reliance should be placed on, the fairness, reasonableness, accuracy, completeness or correctness of such information or opinions contained herein. It is not the intention to provide, and you may not rely on this presentation as providing, a complete or comprehensive analysis of our financial or trading position or prospects. The information and opinions contained in this presentation are provided as at the date of this presentation and are subject to change without notice and will not be updated to reflect any developments which may occur after the date of this presentation. All statements, other than statements of historical facts included in this presentation, are or may be forward-looking statements. Forward-looking statements include, but are not limited to, those using words such as "seek", "expect", "anticipate", "estimate", "believe", "intend", "project", "plan", "strategy", “forecast” and similar expressions or future or conditional verbs such as "will", "would", "should", "could", "may" and "might". These forward-looking statements reflect the Company's current expectations, beliefs, hopes, intentions or strategies regarding the future and assumptions in light of currently available information. Such forward-looking statements are not guarantees of future performance or events and involve known or unknown risks and uncertainties. Accordingly, actual results may differ materially from information contained in the forward-looking statements as a result of a number of factors. You should not place undue reliance on such forward-looking statements, and the Company does not undertake any obligation to update publicly or revise any forward- looking statements. No statement in this presentation is intended to be or may be construed as a profit forecast. We also do not undertake any obligation to provide you with access to any additional information or to update this presentation or any additional information or to correct any inaccuracies in this presentation or any additional information which may become apparent. This presentation does not constitute an offer or invitation to purchase or subscribe for any shares and no part of it shall form the basis of or be relied upon in connection with any contract, commitment or investment decision in relation thereto. 2#3Agenda 01 | Key Highlights AI 02 | Financial Performance 03 Q3 2023 Revenue Guidance 04 | Key Investor Takeaways 05 Q&A 4500101 10101011011000 101 100 1010100100 1101100010110 1010101101100010110010101001011010110111 PLLL 1000 1010101101 onion : 10101011011000101100 1010101101100010110010 ASMPT digital world 3#4Private and confidential ASMPT digital world enabling the Key Highlights 5#5Advanced Packaging Highlights Positioned Well for Generative Al and HPC Growth 1H 2023 Group Revenue US$998M Thermo-Compression Bonding (TCB): Advanced Packaging -19% . • Highest contribution to AP revenue Logic: Key enablers of C2W and C2S processes ASMPT digital world Memory: Fulfil demanding requirements for next-gen HBM, won repeat HBM orders Mass Reflow High Precision Die-bonding: Continuous order from top global customers Hybrid Bonding: Engagement in various end-market applications, including memory Other solutions benefitting from generative Al demand: Silicon photonics, laser singulation, panel ECD and SMT placement tools Physical Electro- Chemical Deposition Vapor Deposition (Wafer/ Panel Level Plating) * Laser Singulation * Wafer/ Panel Level Fan Out* Ultra Precision Die Bonding Mass Transfer & Bonding (Advanced (Silicon Photonics) * Displays) Multi-Chip Module Bonding Thermo Compression Bonding SMT Hybrid Bonding * Flip Chip Wafer Level Fan In SiP Placement Apollo Series Stratus Series Conductor Laser 1205 NUCLEUS NANO AD300 Vortex II Series VECTOR FIREBIRD Lithobolt AD8312FC SUNBIRD SIPLACE TX Micron Comprehensive Range of Advanced Packaging Solutions Advanced packaging solutions for generative Al and HPC 5#6TCB - Key Enabler for Generative Al and HPC Accelerated Adoption of TCB ASMPT digital world Generative Al Chip Demand Drivers Accelerated TCB Adoption Increased number of logic chiplets & new generation HBM Exponential increase in interconnects ~90% handled by TCB TCB Equipment Market * Inflection Point FY12 FY24 * Source: Company management's estimates ASMPT's Unique TCB Capabilities • Best in class die placement accuracy (<1 μm) • Thin die handling • Ultra fine pitch bonding • (<15 μm) Multi die format (up to 100x100mm) 6#7• Automotive Highlights 1H 2023 Group Revenue US$998 M Automotive ~23% ASMPT digital world Automotive CIS Solutions Laser Singulation & Silver Sintering Solutions Vehicle LiDAR Module Power Module Highest revenue contribution, spanning across ⚫ Group's mainstream solutions Has begun to normalise after strong contribution over the last two years Design wins translating into future HVM demand Advanced Packaging Solutions Self-Drive Computing Board SMT Solutions Automotive PCB LED Advanced Display Solutions In-Vehicle Micro LED Display Die/Wire Bond & Mold Power Discrete Packages Analog, Logic, MCUs 7#8MAX MIN 581 Private and confidential ASMPT enabling the digital world 80% MAX Financial Performance wwww ESGX 7737 367 B2%#91H 2023 Key Financials Revenue US$998 M $ (-25.3% YoY)¹ (-12.1% HOH)1 Bookings US$838M Gross Margin (-43.9% YoY)1 (-2.7% HOH)1 % 40.3% (-89 bps YoY) (-86 bps HoH) Net Profit HK$623M (-64.1% YoY) (-29.5% HOH) The YoY & HOH % comparison is based on financials denominated in HK$ Note: 1 יווויי EPS HK$1.52 (-63.9% YoY) (-29.3% HOH) ASMPT digital world % Operating Margin 10.9% (-804 bps YoY) Backlog US$993M (-30.4% YoY)1 (-13.4% HOH)1 (-318 bps HoH) DPS 28 HK$0.61 808 (-53.1% YoY) 9#101H 2023 Group Financial Results USD'M 1,496 1,338 1,134 998 860 838 1H 2022 2H 2022 1H 2023 ■Bookings ■Revenue Gross Margin 41.2% 41.1% 40.3% HKD'M 1,984 1,252 853 1H 2022 2H 2022 ■Operating Profit 1H 2023 Operating Margin 18.9% 14.1% 10.9% ASMPT digital world Revenue Declined HoH and YoY due to SEMI Bookings • • Declined HoH due to SMT, while SEMI grew from low base Declined YoY due to high base effect AP, Automotive and Industrial accounted for ~57% Gross margin Declined HoH and YoY due to segment mix; SMT revenue contribution -59% 10 10#11Q2 2023 Group Financial Results USD'M 664 593 500 497 453 384 Revenue ASMPT digital world • Above mid-point of guidance Q2 2022 Q1 2023 Q2 2023 . Declined YoY due to high base effect ■Bookings ■Revenue Gross Margin 41.7% 40.4% 40.1% HKD'M 980 Q2 2022 Operating Margin 18.8% 466 387 Q1 2023 ■Operating Profit Q2 2023 11.9% 9.9% Bookings • • Declined QoQ due to ongoing industry downcycle Declined YoY due to high base effect Gross margin • Declined QoQ and YoY due to SEMI, partially offset by improvement from SMT 11#12Q2 2023 Semiconductor Solutions Segment Performance 392 272 USD'M 192 197 211 162 Q2 2022 Q1 2023 ■Bookings Revenue Gross Margin 44.7% 45.1% HKD'M Q2 2023 42.7% 617 38 27 ASMPT digital world Revenue • • IC/Discrete: Highest contribution from TCB; uptick in contribution from mainstream tools Optoelectronics: QoQ growth driven by wire bonders for Conventional Displays and high-end Silicon Photonics CIS: Continued weakness in smartphone market • Q2 2022 Q1 2023 Segment Profit Q2 2023 Segment Margin 20.1% 2.5% 1.7% Bookings Declined QoQ and YoY due to ongoing semiconductor downcycle Gross margin Declined QoQ due to higher mix of wire bonders Declined YoY due to volume effect 12#13Q2 2023 SMT Solutions Segment Performance USD'M 321 303 272 286 261 223 Q2 2022 Q1 2023 Q2 2023 ■Bookings Revenue 37.4% 38.2% Gross Margin 37.4% HKD'M ASMPT digital world Revenue Driven by Industrial and Automotive, mostly from Europe Bookings • Entered normalisation phase after high levels for more than 2 years 480 • 400 428 Driven mostly by Industrial and Automotive Q2 2022 Q1 2023 Segment Profit Q2 2023 20.2% 19.1% Segment Margin 18.8% Gross margin Increased QoQ and YoY due to favourable product mix 13#14Key End-Market Applications Serving Broad-based End-Market Applications* 1H 2023 Group Revenue Note: ** ASMPT digital world Automotive Industrial Consumer Computers Communication Others Visual Sensors Infotainment LIDAR Sensors V2X communications Entertainment Platforms ~23% EV Charging Smart Factories Smart Offices Other Industrial PAR OMETER 1974 TV Wearables Audio devices Video devices Gaming consoles Other Consumers Personal Computers Servers Datacentres HPC Other Computers Mobile Phones Wired Infrastructure Wireless 5G Communications Infrastructure Medical Devices Aerospace Others** -18% -13% -12% -10% ~24% Revenue mix is based on management's best estimates Others include revenue from spares, services and other applications that cannot be meaningfully identified 14#15Key Partner to Global Customers 50% 44% 39% 40% 30% 30% 30% Group Revenue Contribution by Geography ASMPT digital world 21% 20% 15% 10% 19% 14% 10% 9% 8% 7% 6% 5% 4% 3% 3% 3% 3% 2% 3% 2% 3% 3% 2% 2% 1% 2% 2% 1% 1% 0% China Europe Americas Malaysia Korea Taiwan Thailand Vietnam Japan Philippines 1H 2022 ■2H 2022 ■1H 2023 1% 2% Others 15#16Returning To Shareholders. ASMPT enabling the Consistent Dividend Payout Ratio Policy Supported by Healthy Cash Flow digital world Dividend Payout (%) FY13 FY14 FY15 FY16 FY17 FY18 FY19 FY20 FY21 FY22 1H23 61% 53% 59% 53% 36% 49% 132% 68% 51% 50% 40% Dividend Per Share (HKD) 2.6 1.9 1.4 1.3 0.7 2.0 1.3 1.1 0.4 0.5 1.2 1.3 1.3 1.3 1.3 1.0 0.8 0.8 0.7 0.6 0.4 FY13 FY14 FY15 FY16 FY17 FY18 FY19 FY20 FY21 FY22 1H23 ■Interim Dividend ■Final Dividend Dividend policy of consistent annual dividend payout of around 50% (consistent with average dividend payout ratio 2013-2022) 16 160#17Private and confidential Q3 2023 ASMPT enabling the digital world Revenue Guidance#18Q3 2023 Revenue Guidance ASMPT digital world Near term visibility continues to be limited due to: Uncertainty in macroeconomic environment • Tepid consumer sentiment Ongoing inventory digestion As SMT continues to normalise, the Group expects Q3 2023 revenue to be: US$410m to US$480m (-23.4% YoY and -10.5% QoQ at mid-point of guidance) Longer-term outlook remains strong due to: . Structural trends of automotive electrification, smart factories, green infrastructure, 5G, IoT and high-performance computing fueled by generative Al growth 18#19Private and confidential LL 22 enabling the ASMPT digital world Key Investors Takeaways#20Key Investor Takeaways Unique Broad-based Portfolio ASMPT digital world Strong Tailwinds Long-Term Secular Growth Drivers (5G/AI/Advanced Displays / Automotive/HPC/loT) Addressable Market Expansion Advanced Packaging: US$2.5B (2027) (23-27F CAGR: ~13%) 1 Automotive: US$2.9B (2027) (23-27F CAGR: ~10%)¹ Unique Broad-based Portfolio Mainstream & Applicative Tools Volume Leverage + Cash Generators Mainstream Die & Wire Bonders, Test Handlers and Encapsulation tools Mainstream SMT Printing and Placement Applicative Camera Module, Lens Attach and Active Alignment Advanced Packaging Tools High Growth + High Margin Mid-End Deposition and Laser Singulation Ultra-Precision Placement Mini/Micro LED, TCB and Hybrid Bonding System-in-Package Die Bonder and SMT Placement Long-Term Performance Less Cyclical Revenue and Profitability Structural Revenue Growth and Margin Expansion Bullish Growth of Global Semiconductor Device Market US$ 990.31B (2028) (23-28F: CAGR: 8.03%)² 1 Company Management's Estimates (Last updated in Q4 2022) 2 Mordor Intelligence Software Solutions for Smart Manufacturing 20 20#21Private and confidential O Q&A ASMPT enabling the digital world#22Wh ΑΙ 1010101101100010110010101010 2000101 1010101101000101 10010101001ort 100101010010 101010110110001011001010100101 101011011000101 10101011010001011 100010101001011010 Private and confidential 皿: ASMPT enabling the digital world Thank You! For enquiries, please contact: Mr. Romil Singh /[email protected] Mr. Leonard Lee / [email protected] asmpt.com#23Wh 1010101101100010110010101010 2000101 1010101101000101 10010101001ort 100101010010 101010110110001011001010100101 101011011000101 10101011010001011 100010101001011010 ΑΙ 皿: ASMPT enabling the digital world Appendix 101010110110001011001 10101100010110010101001011Cont#24Advanced Packaging Interconnects by TCB = 54 Example of a High-end HPC device using both TCB & Hybrid Bonding Memory stacking (A) 48 interconnects (4 x 12 = 48) Bonding to Passive Interposer 5 interconnects 4(A) + 1(B) = 5 Compound die to HDI substrate 1 interconnect (1 x 1 = 1) 1x Memory, 12x stacks (A) 1x Memory, 12x stacks (A) 3D Integrated IC with 6 Chiplets (B) Compound die to HDI substrate 1x Memory, 12x stacks (A) 1x Memory, 12x stacks (A) ASMPT digital world Interconnects by HB = 6 Chiplet integration to Active Interposer (B) 6 interconnects (6 x 1 = 6) Passive interposer Active interposer -HDI Substrate In this example, interconnects handled by TCB-9x those handled by HB 24