#1KLA+ Evercore ISI AutoTech & Al Forum KLA Opportunities in Automotive Oreste Donzella Executive Vice President, EPC Group KLA Corporation May 25, 2023#2Disclaimer Statements in this presentation other than historical facts, such as statements pertaining to: (i) future industry demand for semiconductors and WFE; (ii) future development of regulatory landscape; (iii) our market position for the future; (iv) our forecast of financial measures for the following quarter and 2023; (v) our long-term financial targets and underlying assumptions; (vi) our future investment plan on R&D, technology and infrastructure; and (vii) future shareholder returns, are forward-looking statements and subject to the Safe Harbor provisions created by the Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on current information and expectations and involve a number of risks and uncertainties. Actual results may differ materially from those projected in such statements due to various factors, including but not limited to: the impact of the COVID-19 pandemic on the global economy and on our business, financial condition and results of operations, including the supply chain constraints we are experiencing as a result of the pandemic; economic, political and social conditions in the countries in which we, our customers and our suppliers operate, including rising inflation and interest rates, Russia's invasion of Ukraine and global trade policies; disruption to our manufacturing facilities or other operations, or the operations of our customers, due to natural catastrophic events, health epidemics or terrorism; ongoing changes in the technology industry, and the semiconductor industry in particular, including future growth rates, pricing trends in end-markets, or changes in customer capital spending patterns; our ability to timely develop new technologies and products that successfully anticipate or address changes in the semiconductor industry; our ability to maintain our technology advantage and protect our proprietary rights; our ability to compete with new products introduced by our competitors; our ability to attract, onboard and retain key personnel; cybersecurity threats, cyber incidents affecting our and our customers, suppliers and other service providers' systems and networks and our and their ability to access critical information systems for daily business operations; liability to our customers under indemnification provisions if our products fail to operate properly or contain defects or our customers are sued by third parties due to our products; exposure to a highly concentrated customer base; availability and cost of the wide range of materials used in the production of our products; our ability to operate our business in accordance with our business plan; legal, regulatory and tax environments in which we perform our operations and conduct our business and our ability to comply with relevant laws and regulations; increasing attention to ESG Matters and the resulting costs, risks and impact on our business; our ability to pay interest and repay the principal of our current indebtedness is dependent upon our ability to manage our business operations, our credit rating and the ongoing interest rate environment, among other factors; our ability or the ability of our customers to obtain licenses for the sale of certain products or provision of certain services to customers in China, pursuant to regulations recently issued by the Bureau of Industry and Security of the U.S. Department of Commerce, which could impact our business, financial condition and results of operations; instability in the global credit and financial markets, including existing and future bank failures; our exposure to currency exchange rate fluctuations, or declining economic conditions in those countries where we conduct our business; changes in our effective tax rate resulting from changes in the tax rates imposed by jurisdictions where our profits are determined to be earned and taxed, expiration of tax holidays in certain jurisdictions, resolution of issues arising from tax audits with various authorities or changes in tax laws or the interpretation of such tax laws; our ability to identify suitable acquisition targets and successfully integrate and manage acquired businesses; and unexpected delays, difficulties and expenses in executing against our environmental, climate, inclusion and diversity or other ESG targets, goals and commitments. For other factors that may cause actual results to differ materially from those projected and anticipated in forward-looking statements in this press release, please refer to KLA Corporation's Annual Report on Form 10-K for the year ended June 30, 2022, and other subsequent filings with the Securities and Exchange Commission. KLA Corporation assumes no obligation to, and does not currently intend to, update these forward-looking statements. 2 KLA Non-Confidential | Unrestricted KLA+#3KLA at a Glance ÅÅÅ ÅÅÅÅÅ Founded in 1976 ~14,000 Employees 3 KLA Non-Confidential | Unrestricted Headquarters in Milpitas, CA $10.5B CY22 Revenue Diversified Leader in the Electronics Ecosystem 吧 19 Locations >65% PhD/Master's among professional roles KLA+#4KLA's Presence in the Electronics Manufacturing Ecosystem SUBSTRATES 700 RETICLES 4 KLA Non-Confidential | Unrestricted CHIPS WAFER-LEVEL PACKAGING COMPONENTS PRINTED CIRCUIT BOARD FLAT PANEL DISPLAY AUTOMOTIVE CONNECTED DEVICES MOBILE DEVICES 5G O INFRASTRUCTURE DATA 8 9 .. ** KLA+ Q#5Automotive Electronics + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + - + +_+______ KLA+ + + + + + + + + + + + + + +#6Chip Shortage ■ The Automotive Industry is Being Transformed... ■ Just-in-time to just-in-case Strategic supply agreements and direct fab investments Electrification New platforms and factories I Batteries, inverters and power semiconductors 6 KLA Non-Confidential | Unrestricted 31 By Billg AMORE FINANCIAL AND BUSINESS NEWS New entrants | New requirements | New partnerships I ■ OEMs working directly with chip companies ■ Subscription services Software-Defined Vehicles >80% of innovation enabled by semiconductors ■ Driver Assistance Sensor proliferation and domain controllers Leading-edge CPU/GPU, memory KLA+#7... $63 Driving Broad-based Demand for Semiconductors Strong Growth Auto Semi Forecast ($Billion) ¹ $74 $82 $88 $95 $103 $110 2023 2024 2025 2026 2027 2028 2029 2030 ¹Source: IHS, Cowen and Company ²Source: Yole- 2021 breakdown ³Source: Yole, others. 25k WSPM typical automotive fab size 7 KLA Non-Confidential | Unrestricted $116 Processors 4% All Device Types² MCU 15% Memory 9% ASIC 7% RF 2% Analog 7% Power 34% Photonics 9% Sensors/MEMS 13% All Design Rules Incremental Automotive Fab Capacity Needed by 2027 (WSPM)³ 370,333 b 146,250 15 6 new new new fabs fabs fabs 110,167 ≥ 350nm 110-250nm 28-90nm 174,250 7 new fabs ≤ 16nm KLA+#8... ■ and Changing Automotive Fab Profiles Mature DR Fabs 200nm fab equipment refresh New 300mm large DR fabs & Series $50 8 KLA Non-Confidential | Unrestricted ELLEM Power Semiconductor Fabs ■ SiC and GaN ■ 300mm IGBT IGBT = insulated gate bipolar transistor D ■ 'Zero Defect' methods ■ Advanced DR Fabs Yield Back-fill leading edge fabs Changing landscape provides new diversified opportunities for KLA Automotive Non- Automotive Time KLA+#9Automotive at KLA + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + - + +_+______ KLA+ + + + + + + + + + + + + + +#10$M Automotive at KLA 37% KLA Auto System Revenue CAGR¹ KLA Automotive Revenue Semiconductor process control Specialty semiconductor process 2017 2018 2019 11% KLA Auto Service Revenue CAGR ¹ 10 KLA Non-Confidential | Unrestricted 2020 2021 >3x KLA vs. Total Auto Semi CAGR² 11 2022 2023F ¹KLA Auto Semi CAGR 2017-2023F 2Combined KLA System + Service revenue (30%) vs. IHS/Cowen total auto semi (8.8%), 2017-2023F >$300M Power SiC Revenue in 2022 M&A >35% Auto % of SPTS Revenue in 2022 Increasing process control intensity Sic KLA+#11Enabling Zero Defect + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + - + +_+______ KLA+ + + + + + + + + + + + + + +#12Potential Reliability Defects Must Be Found to Meet Quality Goals ■ ■ Test Escapes TALL Hard killer defects in a test coverage gap Function of yield and test coverage 12 KLA Non-Confidential | Unrestricted ■ Latent Reliability Defects 1 Become activated some time after test Usually requires statistical approach KLA+#13Dedicated Automotive Inspection Products Launched in 2021 ALA €205 ELING T C205 patterned wafer inspection FOR 13 KLA Non-Confidential | Unrestricted SHITET COME SurScan SPA2 HUM Surfscan SP A2/A3 unpatterned wafer inspection 92 KLA 8 Series 8935 high productivity patterned wafer inspection CREE KLAN I-PATⓇ Modern auto-specific portfolio provides capability, capacity and extendibility 8 Series HAT automated inline screening solution KLA+#14I-PAT® Inline Defect Screening: Leveraging Al to Reduce Risks ALL 14 KLA Non-Confidential | Unrestricted Layer 4 Layer 3 Layer 2 Layer 1 Deep Learning High Priority Defects Mid Priority Defects Low Priority Defects db Aggregated & weighted defectivity Outlier statistical filtering Each die is scored based on aggregate defectivity Merge with electrical test data KLA+#15Enabling Silicon Carbide (SiC) + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + - + +_+______ KLA+ + + + + + + + + + + + + + +#16SiC has significant Cost Issues Typical Yield by Step¹ Substrate and Epitaxy Yield Device Fab Wafer Yield (Scrap) Device Fab - Probe Yield Dicing Yield Packaging Yield Final Test / Burn-in Yield - Overall Yield < 50% 65% 92% 16 KLA Non-Confidential | Unrestricted 80% 98% 99% 97% ¹SiC yield and cost are typical values (2023), compiled from Yole, JP Morgan, PGC Consultants, KLA data, and other sources. Large variation from fab-to-fab. 2At equivalent performance for EV traction inverter mission profile compared to comparable Si IGBT device. ³See, for example, Williams-Brown or Seth-Agrawal test escape models Cost 3x 1 $ Si IGBT Reliability SIC² Yield Loss 25% Escapes = f (yield, test coverage)³ Burn-in 5% Significant Cost Increase due to substrate immaturity and device yield issues Device Fab 20% Sic Substrate 40% Epitaxy 10% KLA+#17SiC at KLA Proven Solutions soitec Soitec boosts customer yield of Silicon Carbide semiconductor manufacturing with KLA inspection technology Soitec boosts customer yield of Silicon Carbide semiconductor manufacturing with KLA inspection technology Bernin (Grenoble), France, July 13th, 2022 Soitec (Euronext Paris), an industry leader in designing and manufacturing innovative semiconductor materials, has selected KLA Corporation (NASDAQ: KLAC), a leader in process control and advanced inspection systems, to enable high yield manufacturing of innovative Silicon Carbide (SIC) devices for the automotive industry. Soitec leverages its unique and patented SmartSiCTM technology to produce SiC substrates, which aim to improve the performance of power electronics devices and boost electric vehicles' energy efficiency. Based on its track record of using KLA's inspectors for its Silicon-on-Insulator (SOI) wafers, Soitec has extended its partnership with KLA and selected the Surfscan" SP AZ unpatterned inspection system for its SmartSICTM wafers. Soitec's SmartSicTM wafers provide superior and unique crystal quality, while KLA's Surfscan SP A2 leverages DUV optics and advanced algorithms to support substrate quality control. This partnership will enable SIC substrate production at new and even more sophisticated levels, supporting the industry to bring high quality SiC semiconductors in high volumes to the automotive market. 17 KLA Non-Confidential | Unrestricted Highlights from KLA's SiC Portfolio Process SPTS го THE plasma etch Inspection Wy Metrology SETS MACH plasma dicing Lar ULA PECVD **** S SPTS III. inspection solutions for substrate/epitaxy, patterned wafer and inline defect screening DE Escape PVD At Risk wh Overkill metrology solutions for wafer shape, films, overlay, CD, implant and analytics KLA+#18KLA Solutions are Central to SiC Cost Reduction Improve Yield More functioning die per wafer K Technology Migration 18 KLA Non-Confidential | Unrestricted Better performance and power density (Amps/mm²) Source DH n+ p Gate n+ Drain P n+p+ Image courtesy Infineon Source Gate n+ n+ Drain n+ p+ Substrate Innovation Lower substrate costs Fewer defects Engineered SiC substrates Novel wafering processes SiC growth technologies 150-200mm Wafer Size 1.8x more die per wafer 150mm Substrate/epi inspection | Product wafer inspection | Metrology | Unit process development 200mm KLA+#19Summary + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + + - + +_+______ KLA+ + + + + + + + + + + + + + +#20Automotive is a Growth Engine Across the Entire Company Announcing IMEC & KLA STAR Consortium 20 KLA Non-Confidential | Unrestricted Semiconductor Talent and Automotive Research ■ ■ ■ ■ Research for electrification and autonomous reliability Connecting automotive ecosystem and research institutions Training future talent Global partnership with regional execution Europe Michigan, U.S. ■ Japan KLA+#21MOU Signing with Founding Partners Chris Kolb VP, Govt Relations U-Michigan Rose Bellanca President Washtenaw Community College 21 KLA Non-Confidential | Unrestricted Quentin Messer ww MICHIGAN STAR SEMICONLISTER TELENT RE mec CEO IMEC K# STELLE ARCHER CEO MEDC Luc Van den hove Wadden Gov. Whitmer Rick Paul Krajewski GM Rep. Slotkin (D-MI) Rep. Dingell (D-MI) KLA+#22Summary 00000000000000 201 YOUTU1010100TU 101100101000010010010000011010101010 100110110010011010 00101001001010010010000 000101010011011001100101100101001001010010 0000000101011001101100100110100101100101001001010 0010100101010100000111111111111000010101100110110000 11001006 5001010236 PA UsDon TOUTOOTO011010101010 001010010010000 P10001710000001010110011011001001101001011001010010010: 0100111000000101011001011001001101001011001010010016 10102010702010010100101010010101010101010010101001 CADWOKO 5001101100100110100101100101001010101001 6611911090150100101100101001001010010012 3000 WOOD 22 KLA Non-Confidential | Unrestricted 100 000000 000000 000000 000000 Koo The automotive industry has been forever changed by the chip shortage, vehicle electrification and the software-defined vehicle. KLA works closely with the automotive ecosystem to develop a comprehensive portfolio of process control solutions. The rise of SiC power semi devices poses additional yield, reliability, and cost challenges. Inline defect screening is being adopted by automotive fabs to reduce escapes for reliability sensitive devices. KLA+#23FFF KLA+ Keep Looking Ahead 802 du3 1 0100011101 110101100 0010011 001110 10010 1001 010